MICROPHONE PACKAGE AND METHOD FOR MANUFACTURING SAME

摘要

A microphone package and a method for manufacturing the same are disclosed. The microphone package of the present invention comprises: a substrate comprising a top side having a mounting pad and a bottom side having an inputting and outputting pad; a cover coupled to the substrate to form an internal space and comprising multiple fine holes passing through an external side and an internal side; and a transducer housed in the internal space and mounted on the mounting pad.