LIGHT COUPLING FORMATION IN A WAVEGUIDE LAYER

摘要

An approach is provided for forming a light coupling in a waveguide layer. The approach involves forming a waveguide layer overlaying an upper surface of a substrate. The approach also involves placing a chip package portion within the waveguide layer in a selected position. The approach further involves forming a molding compound layer overlaying the waveguide layer and the chip package portion. The approach additionally involves curing the molding compound layer to form a cured package. The approach also involves releasing the cured package from the substrate and inverting the cured package. The approach further involves forming a ridge waveguide structure in the waveguide layer by removing a portion of the lower surface of the cured package.

主权项

1. A method comprising:
forming a waveguide layer overlaying an upper surface of a substrate; placing a chip package portion within the waveguide layer in a selected position; forming a molding compound layer overlaying the waveguide layer and the chip package portion; curing the molding compound layer to form a cured package, the cured package comprising the waveguide layer, the chip package portion and the molding compound layer, the cured package having an upper surface distal the upper surface of the substrate and a lower surface proximate the upper surface of the substrate; releasing the cured package from the substrate; inverting the cured package; and forming a ridge waveguide structure in the waveguide layer by removing a portion of the lower surface of the cured package.