Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said Method

摘要

A method for minimizing voids when soldering a printed circuit board being equipped with components, in particular with electrical and/or electronic components, includes oscillation of the printed circuit board while the solder situated between the components and the printed circuit board is being melted or after it has been melted. In this respect, the frequency of the oscillation changes between a starting frequency and a final frequency. Preferably, the oscillation is introduced in a direction of the printed circuit board plane by directly or indirectly coupling at least one actuator to at least one lateral edge of the printed circuit board, wherein the lateral edge of the printed circuit board, the edge being opposite to the actuator in each instance, is supported at a dead stop.

主权项

1. A method for minimizing voids when soldering a printed circuit board being equipped with electrical and/or electronic components, said method comprising:
applying solder between the components and the printed circuit board; oscillating the printed circuit board at a frequency of oscillation while the solder is being melted or after the solder has melted, wherein the oscillation of the printed circuit board is introduced in a direction of a printed circuit board plane by directly or indirectly coupling at least one actuator to at least one lateral edge of the printed circuit board, wherein the lateral edge of the printed circuit board, the edge being opposite to the actuator in each instance, is supported at a dead stop; and changing the frequency of the oscillation between a starting frequency and a final frequency.