| 发明名称 |
METHOD FOR BONDING A PELLICLE, AND A BONDING APPARATUS USED IN THIS METHOD |
| 摘要 |
Here is proposed a method for bonding a pellicle to a stencil such as mask plate, which is characteristic in that the stencil-bonding agglutinant layer of the pellicle is warmed under load while the pellicle is being bonded to the stencil, preferably at a temperature in a range of 35 through 80 degrees C., and the load is increased stepwise and with intermittent removal of the load. |
| 申请公布号 |
US2015129103(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201414535998 |
申请日期 |
2014.11.07 |
| 申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
Hamada Yuichi |
| 分类号 |
G03F1/38;B32B37/18;B32B41/00;B32B37/12 |
主分类号 |
G03F1/38 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for bonding a pellicle for lithography to a stencil, said pellicle comprising a frame having two annular faces, a membrane bonded to one annular face of the frame via an adhesive and an agglutinant layer laid on the other annular face of the frame; said method comprising steps of: contacting the frame with the stencil via said agglutinant layer, and warming said agglutinant layer under a predetermined load pressure. |
| 地址 |
Tokyo JP |
