SILVER PLATING MATERIAL AND METHOD FOR MANUFACTURING SAME

摘要

Electroplating is performed at a liquid temperature of 12-24°C and a current density of 3-8 A/dm2 in a silver plating solution containing 80-110 g/L of silver, 70-160 g/L of potassium cyanide, and 55-70 mg/L of selenium, the product of the density of the potassium cyanide in the silver plating solution and the current density being within a range of 840 g × A/L × dm2 or less; and a surface layer comprising silver is formed on a base material, whereby a silver plating material is manufactured in which the preferential orientation plane of the surface layer is a (111) plane, and the ratio of the half-value width of the X-ray diffraction peak of the (111) plane after heating at 50 °C for 168 hours to the half-value width of the X-ray diffraction peak of the (111) plane before heating is 0.5 or more.