| 摘要 |
Embodiments relate generally to network system and apparatus for heat management of high volume network devices. More specifically, disclosed are system and apparatus that provide for improving heat dissipation of the network devices through improved air circulations, including a PCB (104) with at least one slot (108, 110, 112) and a connector cage (102) mounted on the printed circuit board (104), the connector cage (102) being within a certain distance from the at least one slot (108, 110, 112) in the PCB (104). |
