| 发明名称 |
SOLDER BUMP ARRANGEMENTS FOR LARGE AREA ANALOG CIRCUITRY |
| 摘要 |
<p>An integrated circuit (IC) (100, 1200) can include an analog region (130, 1230) of a die (1 10, 1210) of the IC. The analog region includes analog circuitry. The IC further includes a plurality of solder bumps (205) implemented on a surface of the die in an area in vertical alignment with the analog region of the die.</p> |
| 申请公布号 |
WO2015069741(A2) |
申请公布日期 |
2015.05.14 |
| 申请号 |
WO2014US64090 |
申请日期 |
2014.11.05 |
| 申请人 |
XILINX, INC. |
发明人 |
LOWNEY, DONNACHA;DE LA TORRE, MARITES;GORMAN, CHRISTOPHER, M. |
| 分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
| 代理机构 |
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