| 摘要 |
A conventional configuration such that the copper electrode bars which are connected to the P, U and N output electrodes of the inverter module respectively are allowed to come in close proximity to each other and are disposed above the upper faces of the chips has been insufficient for the object of lowering unnecessary inductance components. The semiconductor apparatus includes: the first lead frame (1); the second lead frame (2); the second insulation resin (8) which is disposed between the first lead frame (1) and the second lead frame (2); the sealing resin (9) which seals the semiconductor elements (4a) and (4b), the first lead frame (1) and the second lead frame (2); the electric wiring part (5) which electrically connects the semiconductor elements (4a) and (4b) and the first lead frame (1); and the interlayer connecting part (6) which electrically connects the first lead frame (1) and the second lead frame (2). |
