| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a photoresist stripping liquid for stripping a photoresist that has been exposed to an etchant for Cu in the process of forming wiring lines by wet-etching a Cu or Cu alloy layer on a substrate having a large area and thereby, that is deteriorated and turned into less strippable, without damaging the Cu layer, as well as the stripping liquid preventing reduction in an adhesive force with a layer to be deposited on the Cu layer. <P>SOLUTION: The photoresist stripping liquid comprises 1 to 9 mass% of a tertiary alkanol amine, 10 to 70 mass% of a polar solvent, and 10 to 40 mass% of water. Although the obtained stripping liquid induces slight corrosion of copper, the liquid gives good adhesiveness with a layer to be deposited on a Cu layer and has no problem for practical use. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
