发明名称 |
Assemblies and methods for dissipating heat from handheld electronic devices |
摘要 |
<p>According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.</p> |
申请公布号 |
EP2509403(B1) |
申请公布日期 |
2015.05.13 |
申请号 |
EP20120173898 |
申请日期 |
2010.06.01 |
申请人 |
LAIRD TECHNOLOGIES, INC. |
发明人 |
HILL, RICHARD F.;RIAZ, SHAHI |
分类号 |
H05K7/20;G06F1/20;H04M1/02 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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