发明名称 SILVER PLATING AND PRODUCTION METHOD THEREFOR
摘要 There is provided a silver-plated product which has a good bendability and which can restrain the rise of the contact resistance thereof even if it is used in a high-temperature environment, and a method for producing the same. In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material of copper or a copper alloy, or on the surface of an underlying layer of copper or a copper alloy formed on the base material, the percentage of an X-ray diffraction intensity on {200} plane of the surface layer with respect to the sum of X-ray diffraction intensities on {111}, {200}, {220} and {311} planes of the surface layer is 40 % or more.
申请公布号 EP2749673(A4) 申请公布日期 2015.05.13
申请号 EP20120837569 申请日期 2012.09.20
申请人 DOWA METALS & MINING CO., LTD. 发明人 SHINOHARA, KEISUKE;OGATA, MASAFUMI;MIYAZAWA, HIROSHI;SUGAWARA, AKIRA
分类号 C25D7/00;C25D3/46;H01H11/04;H01R13/03;H01R43/16 主分类号 C25D7/00
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