发明名称 |
SILVER PLATING AND PRODUCTION METHOD THEREFOR |
摘要 |
There is provided a silver-plated product which has a good bendability and which can restrain the rise of the contact resistance thereof even if it is used in a high-temperature environment, and a method for producing the same. In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material of copper or a copper alloy, or on the surface of an underlying layer of copper or a copper alloy formed on the base material, the percentage of an X-ray diffraction intensity on {200} plane of the surface layer with respect to the sum of X-ray diffraction intensities on {111}, {200}, {220} and {311} planes of the surface layer is 40 % or more. |
申请公布号 |
EP2749673(A4) |
申请公布日期 |
2015.05.13 |
申请号 |
EP20120837569 |
申请日期 |
2012.09.20 |
申请人 |
DOWA METALS & MINING CO., LTD. |
发明人 |
SHINOHARA, KEISUKE;OGATA, MASAFUMI;MIYAZAWA, HIROSHI;SUGAWARA, AKIRA |
分类号 |
C25D7/00;C25D3/46;H01H11/04;H01R13/03;H01R43/16 |
主分类号 |
C25D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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