| 摘要 |
The present invention provides a resin composition having a suitable melting temperature for molding, a resin sheet containing the resin composition, a cured resin product excellent in thermal conductivity and heat resistance, and a substrate. They are prepared in the way that in the resin composition containing epoxy compounds and curing agent selected from 1,3,5-tris(4-aminophenyl)benzene and 1,3,5-tris(4-hydroxyphenyl)benzene, the content of 1,3,5-triphenylbenzene that is the main skeleton of the curing agent is 15 mass% or more and 50 mass% or less of the total organic substances in the resin composition. |
