Disclosed is a method for measuring the hardness of a thin film. The method for measuring hardness of the thin film comprises the steps of: providing a substrate in which the thin film is formed; forming a surface layer on the thin film; recognizing the surface layer by a test tip; applying the weight to the test tip so that the test tip penetrates the surface layer and is located inside the thin film; and calculating the hardness of the thin film by using identation depth of the test tip to the weight applied to the test tip, and the thin film.
申请公布号
KR20150051810(A)
申请公布日期
2015.05.13
申请号
KR20130133784
申请日期
2013.11.05
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, SEUNG MI;WOO, SEUNG WAN;LIM, JI HYUK;LEE, KYUNG HO