发明名称 発光素子パッケージ及びこれを備えたライトユニット
摘要 Disclosed are a light emitting device package (100) and a light unit having the same. The light emitting device package includes a body (110) including a cavity (115) at a first side surface, first (121) and second (131) lead frames in the cavity, a light emitting device (150) connected to the first and second lead frames, a heat radiation pad (124) disposed on a second side surface of the body, a heat radiation frame (141) disposed on a third side surface of the body, and first (122) and second (132) electrode pads disposed on the second side surface of the body and spaced apart from the heat radiation pad.
申请公布号 JP5718653(B2) 申请公布日期 2015.05.13
申请号 JP20110007107 申请日期 2011.01.17
申请人 发明人
分类号 H01L33/64;H01L33/62 主分类号 H01L33/64
代理机构 代理人
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