发明名称 METHOD OF FORMING A HERMETICALLY SEALED FIBER TO CHIP CONNECTION
摘要 Disclosed are methods of providing a hermetically sealed optical connection between an optical fiber and an optical element of a chip and a photonic-integrated chip manufactured using such methods.
申请公布号 EP2870495(A1) 申请公布日期 2015.05.13
申请号 EP20130732059 申请日期 2013.06.18
申请人 MICRON TECHNOLOGY, INC. 发明人 MEADE, ROY;SANDHU, GURTEJ
分类号 G02B6/25;G02B6/12;G02B6/255 主分类号 G02B6/25
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