| 摘要 |
In a semiconductor device equipped with a package structure where a memory chip and a controller chip are stacked on a wiring substrate, the degree of freedom of wiring connecting the memory chip and the controller chip is improved. A memory card (1A) comprises a wiring substrate (2), four memory chips (M1-M4) stacked on a main surface, a controller chip (3) installed on a surface of the top memory chip (M4), and an interposer (4). Each of the memory chips (M1-M4) is stacked on a surface of the wiring substrate (2) while a long side faces in a direction identical to a long side of the wiring substrate (2). The lowermost memory chip (M1) is installed on the wiring substrate (2) while spaced as much as a certain distance toward a front end part of the memory card (1A) so as not to be overlapped with a pad (9) of the wiring substrate (2). Three memory chips (M2-M4) stacked on the memory chip (M1) are arranged so that a short side on the side where a pad (6) is formed is located at the front end part of the memory card (1A). |
