PLATING BATH AND METHOD

摘要

A tin containing electric plating bath having a batch of a specific whitening agent provides a tin containing solder deposit having a reduced void formation and a smooth shape. An electric plating composition comprises: a tin ion source; an acid electrolyte; 0.0001-0.045 g/L of a first crystal growth inhibitor; 0.005-0.75 g/L of an α,β-unsaturated aliphatic carbonyl compound as a second crystal growth inhibitor; a non-ionic surfactant; and water.