发明名称 熱処理装置、及びこれに基板を搬送する基板搬送方法
摘要 <p>A heat treatment apparatus includes a vessel loading unit on which a substrate vessel configured to accommodate a plurality of substrates at a first interval is loaded, a substrate holder configured to hold the plurality of substrates at a second interval which is smaller than the first interval, a substrate transfer unit capable of supporting the substrates and configured to transfer the plurality of substrates between the substrate holder and the substrate vessel and includes at least two substrate supporting parts stacked with the first interval therebetween and configured to be simultaneously advanced and retreated relative to the substrate vessel and individually advanced and retreated relative to the substrate holder, and a control unit configured to control an upper one of the at least two substrate supporting parts to be in an inoperative state when a lower one is supporting the substrate.</p>
申请公布号 JP5715904(B2) 申请公布日期 2015.05.13
申请号 JP20110167428 申请日期 2011.07.29
申请人 发明人
分类号 H01L21/677;H01L21/22;H01L21/324;H01L21/683 主分类号 H01L21/677
代理机构 代理人
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