发明名称 レーザラインビーム改善装置およびレーザ処理装置
摘要 <p>The purpose of the present invention is to make it possible to reduce steepness parts effectively, upon line beam projection. Provided is a laser line beam improvement device that includes: a first shielding part (first shielding plate (20)) that is arranged at a position relatively far from an object to be processed (silicon film (100)), on a light path of a line beam (150) projected to the object to be processed, and prevents transmission of long axis end portions of the line beam (150); and a second shielding part (second shielding plate (21)) that is arranged at a position relatively close to the object to be processed, and further prevents transmission of the long axis end portions of the line beam (150) after the transmission of the long axis end portions thereof is prevented by the first shielding part. Also provided is a laser processor that includes the laser line beam improvement device, wherein the first shielding part is arranged between an introduction window (6) and a light condensing lens (21c) that is on the last stage of the optical system outside a processing chamber (2), and the second shielding part is arranged in the processing chamber (2).</p>
申请公布号 JP5717146(B2) 申请公布日期 2015.05.13
申请号 JP20120234158 申请日期 2012.10.23
申请人 发明人
分类号 H01L21/268;H01L21/20 主分类号 H01L21/268
代理机构 代理人
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