| 摘要 |
The present invention relates to a method for expanding wafer and a device manufactured thereby. For achieving the purpose, a method for expanding wafer includes: a first step of separating devices by applying an external force to a dicing tape fixed to the back side of a wafer having multiple devices, a second step of removing the external force applied to the dicing tape, a third step of applying heat to contract the expanded dicing tape; and a fourth step of preventing the expansion of the dicing tape to prevent separated devices from touching each other when the dicing tape is expanded by the external force. According to the method of expanding a wafer, for the expansion of a dicing tap extended by an external force applied for the separation of devices, a separate process of preventing the contraction of a dicing tape is added to contract the dicing tape by applying heat. Thereby, the generation of interference between separated devices can be minimized. |
