发明名称 積層構造体およびその製造方法と、物品
摘要 A multilayer structure wherein a base, an intermediate layer and an outermost layer are sequentially laminated. The intermediate layer has a Martens hardness of 120 N/mm 2 or more; the outermost layer has an elastic modulus recovery ratio of 70% or more; and the surface of the outermost layer is provided with a microrelief structure that has a pitch not more than the wavelength of visible light. A method for producing a multilayer structure wherein a base, an intermediate layer and an outermost layer are sequentially laminated, which comprises the following steps (1)-(3).Step (1): a step wherein an active energy ray curable resin composition (X) containing a compound having a polymerizable functional group is arranged on a light-transmitting base, and then first active energy ray irradiation is carried out, thereby forming an intermediate layer in which the rate of reaction of the polymerizable functional group in the surface is 35-85% by moleStep (2): a step wherein an active energy ray curable resin composition (Y) is arranged between the intermediate layer and a mold for microrelief structure transferStep (3): a step wherein second active energy ray irradiation is carried out from the base side, so that the resin composition (Y) is cured so as to form an outermost layer, and then a multilayer structure is released from the mold.
申请公布号 JP5716868(B2) 申请公布日期 2015.05.13
申请号 JP20140519322 申请日期 2014.04.04
申请人 三菱レイヨン株式会社 发明人 中井 祐介;大谷 剛;小澤 覚;地紙 哲哉
分类号 B32B7/02;B29C39/02;G02B1/11 主分类号 B32B7/02
代理机构 代理人
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