| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for testing a wafer which improves testing accuracy and work efficiency.SOLUTION: A method for testing a wafer performs an electric testing by simultaneously contacting a plurality of probes provided on a probe card with a plurality of pads existing on a chip on the wafer. The testing is performed through: a chuck step S1 of holding the wafer by a wafer chuck and heating the wafer to a testing temperature; a first position recognition step S2 of recognizing all positions of pads of a plurality of chips existing on the wafer; a second position recognition step S3 of recognizing the positions of the pads again for recognizing displacement of the pads caused by thermal expansion due to heating of the wafer chuck, before performing the electric testing; and a correction step S4 of correcting contact positions of the pads with the probes based on the positions of the pads recognized again and updated respectively by the second position recognition step S3 which is based on pad positions recognized by the first position recognition step S2.</p> |
