| 发明名称 |
METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS MADE WITH AN LCP SUBSTRATE |
| 摘要 |
<p>A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.</p> |
| 申请公布号 |
EP1789840(B1) |
申请公布日期 |
2015.05.13 |
| 申请号 |
EP20050781615 |
申请日期 |
2005.08.01 |
| 申请人 |
HARRIS CORPORATION |
发明人 |
SMITH, C.W. SINJIN;NEWTON, CHARLES M.;JAYNES, PAUL B. |
| 分类号 |
H05K3/28;B30B5/02;B30B15/34;B32B37/10;B32B37/18;H05K1/18 |
主分类号 |
H05K3/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
