| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive film for a circuit which ensures adhesion of a base material film and a metal plating film even when the surface of the base material film is not roughened and an adhesive is not used, and exhibits excellent optical transparency and surface smoothness at a part from where the metal plating film is removed by photoetching, and to provide a production method therefor.SOLUTION: In the conductive film for a circuit, a plating ground layer is provided on a base material film, a metal plating film is provided on the plating ground layer by electroless plating, and then the metal plating film is subjected to photoetching, thus patterning the metal plating film on the base material. The plating ground layer is a layer containing a compound having a heterocycle, or a compound having a heterocycle and a metal salt. The part where the metal plating film is removed by photoetching has an optical transparency of 95% or higher, when the optical transparency of the base material film is 100%, and has a surface roughness Ra of 50 nm or less. |
