发明名称 |
A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION COMPRISING A NON-IONIC SURFACTANT AND AN AROMATIC COMPOUND COMPRISING AT LEAST ONE ACID GROUP |
摘要 |
A chemical mechanical polishing (CMP) composition (Q) comprising
(A) inorganic particles, organic particles, or a mixture or composite thereof,
(B) a non-ionic surfactant,
(C) an aromatic compound comprising at least one acid group (Y), or a salt thereof, and
(M) an aqueous medium. |
申请公布号 |
EP2870599(A2) |
申请公布日期 |
2015.05.13 |
申请号 |
EP20130812480 |
申请日期 |
2013.06.27 |
申请人 |
BASF SE;BASF (CHINA) COMPANY LTD. |
发明人 |
REICHARDT, ROBERT;LI, YUZHUO;LAUTER, MICHAEL |
分类号 |
C09G1/02;H01L21/321 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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