| 摘要 |
Provided are: a manufacturing method for an electronic component device that is capable of reducing the weight of an electronic component device, reducing manufacturing costs, shortening manufacturing time and the like, and reliably preventing the adverse effects of moisture, humidity, dust and the like, and in which the reliability of an electronic component does not decline even when manufacturing by injection molding; and an electronic component device. The manufacturing method for an electronic component device includes an integration step in which a melted sealing member (6) is supplied so as to envelop an electronic component (2) and the electronic component (2) is covered so as to be integrated with the sealing member (6). The sealing member (6) comprises a thermoplastic resin to which a foaming agent composition is added, and is foamed at the integration step. At a temperature of 200 °C and a shear rate of 1000(1/s), the thermoplastic resin has a melt viscosity that is equal to or greater than 10 dPa·s and less than 850 dPa·s and a Shore D hardness of less than 60. |
