发明名称 キャリア基板上の部品を伴う配列の製造方法、配列および半製品の製造方法、並びに、半製品
摘要 An arrangement including a carrier substrate, and a component situated on a cover surface of the carrier substrate in a hollow space, and electrical contacts for the component, wherein the hollow space is comprised of a plurality of spacer elements arranged on the cover surface of the carrier substrate and a cover substrate mounted on the plurality of spacer elements is provided. A semi-finished product comprising a carrier substrate made of silicon, wherein one or more recesses are formed on one side of the carrier substrate, and wherein the semi-finished product further comprises an alkaline evaporated glass applied to the side of the carrier substrate having the one or more recesses is also provided.
申请公布号 JP5717744(B2) 申请公布日期 2015.05.13
申请号 JP20120530129 申请日期 2010.09.24
申请人 エムエスゲー リトグラス アクチエンゲゼルシャフトMSG LITHOGLAS AG 发明人 ライブ,ユルゲン;マウス,ジモン;ハンゼン,ウリ
分类号 H01L23/02;H01L23/08;H01L23/14;H01L27/14 主分类号 H01L23/02
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