| 发明名称 |
MICROCHIP AND METHOD FOR PRODUCING MICROCHIP |
| 摘要 |
There is provided a microchip including a plurality of substrate layers, and bonding layers provided at boundary surfaces between the substrate layers and configured to include a silicon compound. At least one of the bonding layers is configured to include an organic silicon compound. |
| 申请公布号 |
EP2871482(A1) |
申请公布日期 |
2015.05.13 |
| 申请号 |
EP20130817319 |
申请日期 |
2013.05.09 |
| 申请人 |
SONY CORPORATION |
发明人 |
WATANABE HIDETOSHI;SEGAWA YUJI;KATO YOSHIAKI |
| 分类号 |
G01N35/08;B01J19/00;G01N37/00 |
主分类号 |
G01N35/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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