| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a die bonder and a semiconductor manufacturing method, capable of reducing a measurement error and an incorrect detection by a non-contact method, capable of continuously monitoring a static electricity amount when handling an electronic component, and capable of instantly coping with an abnormal case by determining an abnormal value in real time. <P>SOLUTION: A die bonder comprises: a pickup portion having a collet to pick up a die; a die bonding portion for bonding the die carried by the collet to a frame; a static electricity measurement sensor for measuring static electricity amount charged in the die by contacting the die; and a pressing force application member attached on a portion of the static electricity measurement sensor so that the static electricity measurement sensor is pressed to the die with a prescribed pressure. The static electricity amount of the die is measured by using the static electricity measurement sensor during a pickup operation. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
