| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To perform frozen cleaning to a substrate at high removal rate and excellent in-plane uniformity. <P>SOLUTION: A melting liquid (DIW) having temperature higher than the freezing point of DIW (freezing target liquid) is locally supplied to a frozen film FF of DIW formed on a substrate W, and a nozzle 8 which ejects the melting liquid is moved to scan along a substrate surface Wf and a supply position of the melting liquid to the substrate W is displaced. Therefore, the flow rate of the melting liquid becomes faster at a plurality of positions on the surface of the substrate W, high removal rate is obtained in each area on the surface of the substrate W, and in-plane uniformity of removal rate is also improved. Further, the nozzle 8 is moved to an outer peripheral edge side of the substrate W following the spreading of interface IF between a region melted by the melting liquid (melted portion MP) and a region not melted by the melting liquid ( frozen film FF) to the outer peripheral edge side of the substrate W, so that substrate damage by an ice block, which occurred in the melted portion MP, can be effectively prevented. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
