Semiconductor sensor device with footed lid

摘要

A semiconductor sensor device is packaged using a footed lid instead of a pre-molded lead frame. A semiconductor sensor die is attached to a first side of a lead frame. The die is then electrically connected to leads of the lead frame. A gel material is dispensed onto the sensor die. The footed lid is attached to the substrate such that the footed lid covers the sensor die and the electrical connections between the die and the lead frame. A molding compound is then formed over the substrate and the footed lid such that the molding compound covers the substrate, the sensor die and the footed lid.

主权项

1. A semiconductor sensor device, comprising:
a substrate including a die attach area and a plurality of electrical connection pads; a semiconductor sensor die attached to the die attach area on a first surface of the substrate and electrically coupled to the substrate by way of the plurality of electrical connection pads; a gel material disposed on a top surface of the sensor die, the gel material covering a membrane of the sensor die; a footed lid, having a top and side walls, attached to the first surface of the substrate, wherein a cavity is formed by the lid and the substrate with the sensor die and electrical connections between the sensor die and the electrical connection pads of the substrate being located within the cavity; and a molding compound formed over the lid and the substrate first surface, and wherein the molding compound fills the cavity.