Optoelectronic semiconductor component

摘要

An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation.

主权项

1. An optoelectronic semiconductor component, comprising
a radiation-emitting semiconductor chip having a radiation coupling-out area, wherein electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling-out area; a converter element disposed downstream of the semiconductor chip at its radiation coupling-out area, the converter element configured to convert electromagnetic radiation emitted by the semiconductor chip, wherein the converter element has a first surface facing away from the radiation coupling-out area; and a reflective encapsulation, wherein the reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner, wherein the converter element projects from the reflective encapsulation, and wherein the first surface of the converter element and side areas of portions of the converter element projecting outwards are free of the reflective encapsulation, and wherein the reflective encapsulation is applied by a jet process.