Electronic component

摘要

An electronic component has a housing body which comprises a semiconductor chip in a recess. The semiconductor chip in the recess is embedded in a casting compound made of a first plastic material having a first glass transition temperature. A cover element made of a second plastic material having a second glass transition temperature is arranged above the recess. The second glass transition temperature is lower than the first glass transition temperature.

主权项

1. An electronic component comprising:
a housing body: a semiconductor chip arranged in a depression within the housing body, wherein the semiconductor chip is embedded in a potting composed of a first plastic material having a first glass transition temperature; and a cover element arranged above the depression, wherein the cover element is composed of a second plastic material having a second glass transition temperature, and the second glass transition temperature is lower than the first glass transition temperature, wherein the first glass transition temperature is in a range between 120° C. and 150° C.; and wherein the second glass transition temperature is in a range between 80° C. and 120° C.