Housing for wafer-level camera module

摘要

A housing for protecting a wafer-level camera module and fixing the wafer-level camera module to a printed circuit board (PCB) includes: four side plates, defining a quadrilateral frame; four supporting plates each fixed to a lower portion of an inner face of a corresponding one of the four side plates, each supporting plate having a top face supporting a portion of the camera module; and four bottom plates each fixed to a lower portion of an outer face of a corresponding one of the four side plates, each bottom plate having a bottom face fixed to the PCB. The housing is capable of addressing the issues of poor housing-PCB soldering, paint falling off and surface scratching and improving the efficiency in UV lamp-utilized UV adhesive curing.

主权项

1. A housing for protecting a wafer-level camera module and fixing the wafer-level camera module to a printed circuit board (PCB), comprising:
four side plates, defining a quadrilateral frame forming a space within said four side plates; four supporting plates each extending into said space from a lower portion of and orthogonal to a corresponding one of the four side plates, a top face of each of the four supporting plates configured to support a portion of the camera module; and four bottom plates each extending outside said space from the lower portion of and orthogonal to a corresponding one of the four side plates, a bottom face of each of the four bottom plates configured to be fixed to the PCB.