Semiconductor device

摘要

In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat dissipating substrate and a wiring substrate. The heat dissipating substrate has a relatively high thermal conductivity, and includes principal surfaces defined by electric insulators, one of which is provided with an outer conductor located thereon. The wiring substrate is mounted on the upper principal surface of the heat dissipating substrate, has a thermal conductivity lower than that of the heat dissipating substrate, and includes a wiring conductor made mainly of silver or copper and located inside the wiring substrate, the wiring conductor being electrically connected to the outer conductor. The semiconductor element is mounted on the upper principal surface of the heat dissipating substrate and disposed in a through hole of the wiring substrate.

主权项

1. A semiconductor device comprising:
a heat dissipating substrate having a relatively high thermal conductivity, the heat dissipating substrate including first and second principal surfaces, at least one of the first and second principal surfaces including an electric insulator provided with an outer conductor thereon; a wiring substrate mounted on the at least one of the first and second principal surfaces of the heat dissipating substrate, having a thermal conductivity lower than that of the heat dissipating substrate, and including a wiring conductor mainly including silver or copper and located inside the wiring substrate, the wiring conductor being electrically connected to the outer conductor; and a semiconductor element that produces heat during operation, mounted on the at least one of the first and second principal surfaces of the heat dissipating substrate, and including a lower-surface electrode located on a mounting surface facing the at least one of the first and second principal surfaces of the heat dissipating substrate, the lower-surface electrode being electrically connected via the outer conductor to the wiring conductor; wherein the first principal surface of the heat dissipating substrate is electrically insulated from the second principal surface of the heat dissipating substrate.