| 发明名称 | Light-emitting diode package | ||
| 摘要 | Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part. | ||
| 申请公布号 | US9029877(B2) | 申请公布日期 | 2015.05.12 |
| 申请号 | US201213420908 | 申请日期 | 2012.03.15 |
| 申请人 | LG Innotek Co., Ltd. | 发明人 | Lee Sangwoo;Won Sunghee |
| 分类号 | H01L33/62;H01L25/075;H01L33/48 | 主分类号 | H01L33/62 |
| 代理机构 | Ked & Associates, LLP | 代理人 | Ked & Associates, LLP |
| 主权项 | 1. A light-emitting device (‘LED’) package, comprising: a body including a cavity; a lead frame disposed in the cavity; and a light-emitting device (‘LED’) electrically connected to the lead frame, the LED being inclined at a prescribed angle relative to a bottom surface of the cavity and including a light emitting part and a non-light emitting part, wherein a recess is provided on the bottom surface of the cavity to accommodate the LED at the prescribed angle relative to the bottom surface. | ||
| 地址 | Seoul KR | ||