发明名称 Integrated microelectronic package temperature sensor
摘要 Temperatures in microelectronic integrated circuit packages and components may be measured in situ using carbon nanotube networks. An array of carbon nanotubes strung between upstanding structures may be used to measure local temperature. Because of the carbon nanotubes, a highly accurate temperature measurement may be achieved. In some cases, the carbon nanotubes and the upstanding structures may be secured to a substrate that is subsequently attached to a microelectronic package.
申请公布号 US9028142(B2) 申请公布日期 2015.05.12
申请号 US201213447469 申请日期 2012.04.16
申请人 Intel Corporation 发明人 Raravikar Nachiket R.;Patel Neha
分类号 G01K7/00;G01K7/16;B82Y15/00 主分类号 G01K7/00
代理机构 Trop, Pruner & Hu, P.C. 代理人 Trop, Pruner & Hu, P.C.
主权项 1. A microelectronic component comprising: an integrated circuit substrate; a microelectronic element on said substrate; a pair of carbon nanotubes supported on said element; and a temperature sensor on said substrate, said substrate electrically coupled to said nanotubes, said sensor to use varying resistance of said nanotubes to develop a temperature indication.
地址 Santa Clara CA US