发明名称 |
LED component, LED module and method for manufacturing the LED component |
摘要 |
A light emitting diode (LED) component includes a base having a main body and a wiring pattern. The main body defines an axis and includes two connecting surfaces respectively located at two opposite sides thereof, and a plurality of interconnected mounting surfaces surrounding the axis and connected between the connecting surfaces. The wiring pattern is at least disposed on the mounting surfaces and includes electrically insulated anode and cathode. A plurality of light emitting diode (LED) chips are disposed on the mounting surfaces. Each LED chip is electrically connected to the anode and the cathode. |
申请公布号 |
US9028098(B2) |
申请公布日期 |
2015.05.12 |
申请号 |
US201314090312 |
申请日期 |
2013.11.26 |
申请人 |
Lite-On Opto Technology (Changzhou) Co., Ltd.;Lite-On Technology Corp. |
发明人 |
Li Po-Wei |
分类号 |
F21V23/00;H05K3/32;F21K99/00;H05K1/11;H05K3/40;F21V3/00;F21Y101/02;F21Y103/02;F21Y105/00;F21Y111/00;H05K1/18 |
主分类号 |
F21V23/00 |
代理机构 |
Rosenberg, Klein & Lee |
代理人 |
Rosenberg, Klein & Lee |
主权项 |
1. A light emitting diode (LED) component, comprising:
a base having a main body and a wiring pattern, said main body being a polygonal columnar body, defining an axis, and including two connecting surfaces respectively located at two opposite sides of said main body, and a plurality of interconnected mounting surfaces surrounding said axis and connected between said connecting surfaces, said wiring pattern being at least disposed on said mounting surfaces and including an anode and a cathode electrically insulated from each other; and a plurality of light emitting diode (LED) chips disposed on said mounting surfaces, each of said LED chips being electrically connected to said anode and said cathode. |
地址 |
Jiangau Province CN |