发明名称 LED component, LED module and method for manufacturing the LED component
摘要 A light emitting diode (LED) component includes a base having a main body and a wiring pattern. The main body defines an axis and includes two connecting surfaces respectively located at two opposite sides thereof, and a plurality of interconnected mounting surfaces surrounding the axis and connected between the connecting surfaces. The wiring pattern is at least disposed on the mounting surfaces and includes electrically insulated anode and cathode. A plurality of light emitting diode (LED) chips are disposed on the mounting surfaces. Each LED chip is electrically connected to the anode and the cathode.
申请公布号 US9028098(B2) 申请公布日期 2015.05.12
申请号 US201314090312 申请日期 2013.11.26
申请人 Lite-On Opto Technology (Changzhou) Co., Ltd.;Lite-On Technology Corp. 发明人 Li Po-Wei
分类号 F21V23/00;H05K3/32;F21K99/00;H05K1/11;H05K3/40;F21V3/00;F21Y101/02;F21Y103/02;F21Y105/00;F21Y111/00;H05K1/18 主分类号 F21V23/00
代理机构 Rosenberg, Klein & Lee 代理人 Rosenberg, Klein & Lee
主权项 1. A light emitting diode (LED) component, comprising: a base having a main body and a wiring pattern, said main body being a polygonal columnar body, defining an axis, and including two connecting surfaces respectively located at two opposite sides of said main body, and a plurality of interconnected mounting surfaces surrounding said axis and connected between said connecting surfaces, said wiring pattern being at least disposed on said mounting surfaces and including an anode and a cathode electrically insulated from each other; and a plurality of light emitting diode (LED) chips disposed on said mounting surfaces, each of said LED chips being electrically connected to said anode and said cathode.
地址 Jiangau Province CN