发明名称 LED light bar and backlight module using the LED light bar
摘要 The present invention provides an LED light bar and a backlight module using the LED light bar. The LED light bar includes a heat dissipation strip, a PCB mounted on the heat dissipation strip, LED chips mounted on the heat dissipation strip and electrically connected to the PCB, and a thermal interface material layer arranged between the LED chips and the heat dissipation strip. The LED light bar and the backlight module using the LED light bar according to the present invention arrange LED chips to be mounted to a heat dissipation strip that is of bettered thermal conduction performance to thereby avoid the conventional process of transferring terminal energy through a PCB that is of poor heat dissipation. The art is simple and the entire heat dissipation path is shortened to achieve excellent heat dissipation performance and thus ensure the quality of backlighting.
申请公布号 US9028092(B2) 申请公布日期 2015.05.12
申请号 US201213806751 申请日期 2012.11.08
申请人 Shenzhen China Star Optoelectronics Technology Co., Ltd. 发明人 Zhang Tian;Hsiao Yuchun
分类号 F21V29/00;F21V21/005 主分类号 F21V29/00
代理机构 代理人 Chiang Cheng-Ju
主权项 1. An LED (Light-Emitting Diode) light bar, comprising a heat dissipation strip, a printed circuit board (PCB) mounted on the heat dissipation strip, LED chips mounted on the heat dissipation strip and electrically connected to the PCB, and a thermal interface material layer arranged between the LED chips and the heat dissipation strip; wherein the heat dissipation strip comprises an inverted T-shape that comprises a base and a raised portion that is an elongate continuous portion provided on the base and two recesses on opposite sides of the raised portion, the PCB comprising two split pieces respectively received in the recesses, the LED chips being distributed along the raised portion and spaced from each other, each of the LED chips being arranged astride the raised portion to electrically engage the two PCB pieces, the thermal interface material layer being sandwiched between a bottom of each of the LED chips and the raised portion of the T-shape of the heat dissipation strip.
地址 Shenzhen, Guangdong Province CN