Chip-on-film packages and device assemblies including the same

摘要

Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided.

主权项

1. A device, comprising:
a display panel; a frame supporting the display panel; and a chip-on-film package, the chip-on-film package comprising: a film substrate having a first surface and a second surface opposite to each other; a semiconductor chip on the first surface; and a thermal deformation member adjacent to the second surface, wherein the thermal deformation member has a construction that causes its shape to transform according to a temperature, wherein the thermal deformation member has a property that a curvature of the thermal deformation member at a first temperature is greater than a curvature of the thermal deformation member at a second temperature lower than the first temperature; and wherein the frame and the chip-on-film package are positioned such that when the semiconductor chip is heated up, the chip-on-film package including the thermal deformation member changes curvature to contact the frame.