Test vehicles for evaluating resistance of thin layers

摘要

Provided are test vehicles for evaluating various semiconductor materials. These materials may be used for various integrated circuit components, such as embedded resistors of resistive random access memory cells. Also provided are methods of fabricating and operating these test vehicles. A test vehicle may include two stacks protruding through an insulating body. Bottom ends of these stacks may include n-doped poly-silicon and may be interconnected by a connector. Each stack may include a titanium nitride layer provided over the poly-silicon end, followed by a titanium layer over the titanium nitride layer and a noble metal layer over the titanium layer. The noble metal layer extends to the top surface of the insulating body and forms a contact surface. The titanium layer may be formed in-situ with the noble metal layer to minimize oxidation of the titanium layer, which is used as an adhesion and oxygen getter.

主权项

1. A die comprising:
a portion of a substrate; a first test vehicle provided on the substrate and comprising two stacks,
each stack comprising a first layer and a second layer,the first layer comprising a noble metal and forming a first contact surface,the second layer comprising titanium,the two stacks of the first test vehicle being interconnected by a first connector; and a second test vehicle comprising two stacks,
each stack comprising a third layer and a fourth layer,the third layer is positioned within the same plane as the first layer and having the same composition as the first layer,the third layer forming a second contact surface,the fourth layer being positioned within the same plane as the second layer and having the same composition as the second layer,the two stacks of the second test vehicle being interconnected by a second connector.