Method of manufacturing semiconductor device

摘要

To improve the reliability in applying a tape to the rear surface of a substrate while securing the heat resistance of the tape applied to the rear surface of the substrate. There is a gap between a bottom surface of a ditch provided in a support member and an upper surface of a driver IC chip. On the other hand, the upper surface side of a lead frame is supported by the support member so that the bottom surface of the ditch contacts the upper surface of a Low-MOS clip mounted over a Low-MOS chip. Thus, even in a state where the driver IC chip and the Low-MOS chip are mounted on the upper surface side of the lead frame, the tape can be reliably applied to the rear surface of the lead frame (in particular, to the rear surface of the product region).

主权项

1. A method of manufacturing a semiconductor device, comprising the steps of:
(a) preparing a first lead frame having therein a plurality of first regions arranged in a matrix, each first region including a first chip mounting portion, a second chip mounting portion and a first lead, (b) mounting a first semiconductor chip over an upper surface of the first chip mounting portion via a first conductive adhesive, and a second semiconductor chip over an upper surface of the second chip mounting portion via the first conductive adhesive, (c) mounting a first metal plate to a first electrode pad of the first semiconductor chip and to the first lead via a second conductive adhesive, (d) heating the first conductive adhesive and the second conductive adhesive at a first temperature, (e) after step (d), applying a tape to a first face opposite to a face over which the first semiconductor chip is mounted, and to a second face opposite to a face over which the second semiconductor chip is mounted, of the first lead frame, and (f) after step (e), forming a sealing body by collectively sealing a plurality of the first regions in the first lead frame so as to cover the first and second semiconductor chips, wherein step (e) applies the tape to the first lead frame while supporting the first metal plate, wherein step (e) is carried out while the second semiconductor chip is not supported.