Printed circuit board and method of manufacturing the same

摘要

Read wiring traces and write wiring traces are formed on an insulating layer that is formed on a support substrate. Connection terminals that are electrically connectable to external circuits are formed at parts of the read wiring traces and write wiring traces on the insulating layer, respectively. Openings are formed in the support substrate so as to partially or entirely surround overlap regions that overlap with the connection terminals and have the same plane shape as the connection terminals. Parts of the insulating layer are exposed in the openings.

主权项

1. A printed circuit board that is electrically connectable to an external circuit, the printed circuit board comprising:
a support substrate formed of a conductive material; an insulating layer formed on the support substrate; a wiring trace formed on the insulating layer; and a connection terminal formed at part of the wiring trace on the insulating layer and being electrically connectable to the external circuit,
wherein the support substrate has an overlap region that overlaps with the connection terminal and has the same plane shape as the connection terminal,wherein an opening is present in the support substrate so as to partially or entirely surround the overlap region of the support substrate, part of the insulating layer being exposed in the opening,wherein the opening has an outer periphery that is positioned outside of an outer periphery of the overlap region and an inner periphery that is positioned inside of the outer periphery of the overlap region, a distance between the outer periphery of the opening and the outer periphery of the overlap region being not less than 5 μm, and a width between the inner periphery of the opening and the outer periphery of the opening being not less than 25 μm.