| 发明名称 | Integrated circuit packaging system having planar interconnect and method for manufacture thereof | ||
| 摘要 | A method for manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect. | ||
| 申请公布号 | US9029205(B2) | 申请公布日期 | 2015.05.12 |
| 申请号 | US201113041869 | 申请日期 | 2011.03.07 |
| 申请人 | STATS ChipPAC Ltd. | 发明人 | Pagaila Reza Argenty;Do Byung Tai;Kuan Heap Hoe |
| 分类号 | H01L21/00;H01L23/538;H01L23/13;H01L23/31;H01L23/00;H01L25/10 | 主分类号 | H01L21/00 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. A method for manufacture of an integrated circuit packaging system comprising: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect directly on a non-active side of the integrated circuit opposite an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect, the encapsulation exposes a first end of the planar interconnect and covers a second end of the planar interconnect, the second end opposite to the first end. | ||
| 地址 | Singapore SG | ||