Method for producing a flexible circuit configuration

摘要

For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.

主权项

1. A method for producing a flexible circuit configuration (FS), which contains a layer sequence and an insulating carrier film (TF), which lies flatly on the layer sequence (SF) using an inner side (TI) and is connected thereto, comprising the steps of:
depositing a layer sequence (SF) having at least one insulating layer (NF) and at least one structured conductive layer (AS) having terminal surfaces (AF), flatly connecting the insulating carrier film (TF) directly to the layer sequence (SF), creating openings (DT) in the insulating carrier film (TF) up to the terminal surfaces (AF) of the structured conductive layer (AS), creating contact surfaces (KP) directly on the outer surface (TA) of the insulating carrier film (TF), which faces away from the layer sequence (SF), and creating electrical through contacts (KD) in the openings (DT) through the insulating carrier film (TF) to connect the contact surfaces (KP) to the terminal surfaces (AF) of the structured conductive layer (AS).