Transferring an antenna to an RFID inlay substrate

摘要

Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.

主权项

1. A method of making a transponder comprising an inlay substrate, an RFID chip and an antenna structure, characterized by:
forming a wide trench in the inlay substrate for accepting the antenna structure; and after forming the trench, disposing the antenna structure in the trench; wherein: the transponder is located at one of a plurality of transponder sites on the inlay substrate; and further comprising: preparing a plurality of transponder sites on an inlay substrate, each transponder site comprising a defined area of the inlay substrate; forming a plurality of antenna structures on an antenna substrate which is separate from the inlay substrate; and removing given antenna structures from the antenna substrate and transferring them to selected ones of the transponder sites.