Z-connection using electroless plating

摘要

An assembly includes a substrate having a substrate conductor and a contact at a first surface and a terminal at a second surface for electrically interconnecting the assembly with a component external to the assembly, at least one of the substrate conductor or the contact being electrically connected with the terminal; a first element having a first surface facing the first surface of the substrate and having a first conductor at the first surface and a second conductor at a second surface, an interconnect structure extending through the first element electrically connecting the first and second conductors; an adhesive layer bonding the first surfaces of the first element and the substrate, at least portions of the first conductor and the substrate conductor being disposed beyond an edge of the adhesive layer; and a continuous electroless plated metal region extending between the first conductor and the substrate conductor.

主权项

1. An assembly, comprising:
a substrate consisting essentially of dielectric material, having a first surface, a second surface opposite the first surface of the substrate, a substrate conductor and a contact at the first surface, and a terminal at the second surface for electrically interconnecting the assembly with a component external to the assembly, at least one of the substrate conductor or the contact being electrically connected with the terminal; a first element consisting essentially of dielectric material, having a first surface facing the first surface of the substrate and a second surface opposite the first surface, a first conductor at the first surface, a second conductor at the second surface, and interconnect structure extending through the first element electrically connecting the first and second conductors; an adhesive layer bonding the first surfaces of the first element and the substrate with one another, portions of the first conductor and the substrate conductor being disposed beyond a peripheral edge of the adhesive layer; and a continuous electroless plated metal region disposed beyond the peripheral edge of the adhesive layer, the continuous electroless plated metal region extending between the portions of the first conductor and the substrate conductor and extending to a height above the first surface of the substrate, wherein the height is less than a height that the second surface of the first element extends above the first surface of the substrate.