Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

摘要

Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device, which perform a cleaning process on the inside of an exhaust buffer chamber even if gases are exhausted using the exhaust buffer chamber. The substrate processing apparatus includes a processing space to process a substrate on a substrate placing surface, a gas supply system to supply gases into the processing space through a side facing the substrate placing surface, an exhaust buffer chamber including a communication hole communicating with the processing space at least at a side portion of the processing space and a gas flow blocking wall extending in a blocking direction of the gases flowing through the communication hole, a gas exhaust system configured to exhaust the gases supplied into the exhaust buffer chamber, and a cleaning gas supply pipe configured to supply a cleaning gas into the exhaust buffer chamber.

主权项

1. A substrate processing apparatus comprising:
a processing space configured to process a substrate placed on a substrate placing surface; a gas supply system configured to supply gases into the processing space through a side facing the substrate placing surface; an exhaust buffer chamber including a communication hole communicating with the processing space at least at a side portion of the processing space and a gas flow blocking wall extending in a blocking direction of the gases flowing through the communication hole; a gas exhaust system configured to exhaust the gases supplied into the exhaust buffer chamber; and a cleaning gas supply pipe configured to supply a cleaning gas into the exhaust buffer chamber through a connection point installed between the communication hole and the gas flow blocking wall.