METHOD OF MANUFACTURING LED PACKAGE MODULE

摘要

A light emitting diode package according to an embodiment of the present invention comprises: a heat radiation plate formed from a metallic material; a light emitting diode bonded onto an upper surface of the heat radiation plate to expose an upper portion of a first and a second electrode for driving formed thereon; a circuit board bonded onto the heat radiation plate to be separated from the light emitting diode and provided with a first and a second conductive patterns formed on an upper surface thereof and electrically connected to the first and the second electrode of the light emitting diode; dam units protruding from the upper surface of the circuit board to expose the first and the second conductive patterns and form an accommodation space to surround the light emitting diode; a fluorescent substance layer formed from coating a fluorescent substance on an upper surface of the light emitting diode; an encapsulation layer formed from filling the accommodation space inside the dam units with an encapsulation material to cover the fluorescent substance layer; first and second vertical wiring layers formed from the first and the second electrode to an upper surface of the encapsulation layer and formed with a conductive material; third and fourth vertical wiring layers formed from the first and the second conductive patterns of the circuit board to vertically penetrate the encapsulation layer and formed with a conductive material; a first horizontal wiring layer formed with a conductive material to interconnect the first vertical wiring layer and the third vertical wiring layer from the upper surface of the encapsulation layer; and a second horizontal wiring layer formed with a conductive material to interconnect the second vertical wiring layer and the fourth vertical wiring layer from the upper surface of the encapsulation layer. According to the light emitting diode package and a manufacturing method thereof, packaging is possible regardless of a power capacity of the light emitting diode, and large surface area packaging is possible by forming electrical connection wiring with a conductive paste through a via hole penetrating the encapsulation layer.