Conduction cooled high power semiconductor laser and method for fabricating the same

摘要

A conduction cooled high power semiconductor laser and a method for fabricating the same are provided. The conduction cooled high power semiconductor laser comprises a heat sink (2) and one or more semiconductor laser units (1). The semiconductor laser unit consists of a laser chip (3), a substrate (4) bonded to the laser chip for heat dissipation and electrical connection, and an insulation plate (5) soldered to the substrate for insulation and heat dissipation. The semiconductor laser unit is soldered on the heat sink with the insulation plate therebetween. The semiconductor laser unit may be tested, aged, and screened in advance, and thereby the yield of the lasers can be improved and the manufacturing costs can be reduced. The laser has desirable heat dissipation performance, high reliability, and is applicable to high temperature and other complex and volatile environments.

主权项

1. A conduction cooled high power semiconductor laser, comprising:
a heat sink; a first semiconductor laser unit a second semiconductor laser unit, each of the first and second semiconductor laser units comprising:
a laser chip,a substrate bonded to the laser chip for heat dissipation and electrical connection, andan insulation plate soldered to the substrate for insulation and heat dissipation; wherein the first and second semiconductor laser units are soldered together so that the laser chip of the first semiconductor unit is bonded to the substrate of the second laser chip; and wherein the first and second semiconductor laser units are soldered on the heat sink with the insulation plate therebetween.